To reach the best output quality and thus keep our customers satisfied, we use following equipment and practices.
Application of solder paste or glue on the PCB screen printing machines DEK with SPI and Uniprint across stainless steel foil.
Mounting of SMDs is done on fully automatic production machines with loaders, interoperation conveyors, inspection conveyors and unloaders.
The hearts of the line are machines Yamaha YS12, Assembléon MG5 and Assembléon MG-1R with parameters:

• Yamaha YS12
  

  Maximum number of components per hour: 36,000
  Max board size (W x D): 510 x 460 mm
  Min board size (L x W): 50 x 50 mm
  Min component size: 0.4 x 0.2 mm (01005)
  

• Assembléon MG5
  

  Maximum number of components per hour: 20,000
  IPC 9850 the number of components per hour: 14,000
  Placement Accuracy Cpk> 1: 50 micron for chips, 30 micron for QFP
  Min component size: 0.4 x 0.2 mm (01005)
  Max size of components: 100 x 45 mm
  Max component height: 15 mm
  Max board size (W x D): 420 x 460 mm
  Min board size (L x W): 50 x 50 mm
  Thickness: 0.4 to 4 mm
  Automatic jets exchanger
  Automatic jets cleaning
  Number of positions for tape feeder (8 mm): 96

• Assembléon MG-1R
  

  Maximum number of components per hour: 24,000
  IPC 9850 the number of components per hour: 17,400
  Placement Accuracy Cpk> 1: 50 micron for chips, 30 micron for QFP
  Min component size: 0.4 x 0.2 mm (01005)
  Max size of components: 100 x 45 mm
  Max component height: 15 mm
  Max board size (W x D): 440 x 460 mm
  Min board size (L x W): 50 x 50 mm
  Thickness: 0.4 to 4 mm
  Automatic jets exchanger
  Automatic jets cleaning
  Number of positions for tape feeder (8 mm): 96

The lung of the line is a high performance reflow, ensuring proper reflow of the most demanding applications.
Machine soldering we perform with the wave ATF 33/33 or manually THT.
Checks are on AOI.
On request, products are rinsed in an ultrasonic cleaner and we provide thermal cycling of plates in thermo chamber.